In HPC, technological innovation is driving an increasing demand for efficient and energy-saving chips, and advanced packaging technologies are receiving growing attention. JCET delivers one-stop solutions with a full patent portfolio, comprehensive production capacity, and an evolving technology roadmap covering compute, memory, power, and connectivity.

JCET’s XDFOI^® high-density multi-dimensional heterogeneous integration is in stable mass production. This multi-dimensional fan-out chiplet solution integrates package assembly and test across 2D, 2.5D, and 3D technologies, and JCET continues to expand its diverse offerings.